FUTURELED is manufacturing its own LED based on chip level for its own use and OEM applications. Due to the complete manufacturing process, which is covering many different material systems, dicing, and metallization the chips can be tuned to required performance. The peak wavelengths are ranging from 280 to 1080 nm.With these capabilities the broad spectrum can be covered. Many chips offer better performance then other sources and the custom design capabilities offer solutions that exactly match the requirements. In addition with chip selection capabilities to sort LED down to one nm a further fine tuning for demanding application is possible.
LED are the combination of the chip with a proper housing which contains the housing with the gold wire bonded LED. This package has a big influence on the emission characteristics, to possible packaging density and thermal performance and therefore the power and overall stability of the LED.FutureLED uses its own packaging which is optimized to all of these aspects to provide best performance in all aspects.High density LED areas and the use of high performance chips are possible for high performance light sources.
Color Conversion LED
To create specific emission colors different phosphors from green to yellow to orange are available. Their proper use can tune the emitted light to a specific broad spectrum. The area of maximum intensity of light emission (peak wavelength) of the used materials is covering the range from 510 nm to 680 nm. With this technology a greater flexibility for choosing a desired emission spectrum is given. In the SUNlike this special technologies is covering a wide range with a optimal match to A 1.5 G.